XRF-10 No Clean Paste Flux for Lead Free Soldering

XRF-10 paste flux is a mildly activated, resin-based formulation developed to offer a broad process window and pin-probable residues. The superior wetting ability of XRF-10 results in bright, smooth, shiny, solder joints. This Paste Flux offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys. It has shown to reduce or eliminate voiding under micro- BGAs. XRF-10 also offers high humidity tolerance and a chemistry developed for use in air reflow. This material has been utilized on various assemblies with RF designs without cleaning; however, the compatibility of flux residues on RF assemblies is strongly dependent upon circuitry design.

Features:

  • For use with Lead-Free alloys and also Sn/Pb alloys
  • Pin probe testable residues
  • Reduces voiding
  • Excellent wetting
  • Aqueous clean if required
  • Air reflow / nitrogen not necessary
  • Can be printed, brushed, or dispensed

Part #: XRF-10A

Part #: XRF-10M

XRF-10MC

Part #: XRF-10MC



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American Distribution

United States of America,
Canada and Mexico: 
BOMIR INC. (Master Distributor)
E-mail: bomir@bomir.com
Tel: (570)842-4725
Fax: (570)842-4290

Disclaimer

Bokar International is committed to continuing development of new products and improvements to existing products. Specifications are subject to change without notice.

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