BGA Re-Balling and Fluxing Systems

XURB Universal Re-balling Unit

 

XURB-H Heating Unit with XURB-CF cooling fan

 

The XURB-S set has is an independent heating system, a Hot Plate XURB-H matching the re-balling fixture.

This heating method allows for reflow of re-balled IC in approximately 2 min., which is 2 to 3 times faster and better than on any other heating system.

Specifically designed for XURB, the XURB-H unit has temperature controller with closed loop feedback, which guarantees proper heating rate and maximum temperature limit preventing re-balled component damage.

It also includes cooling fan, like no other unit in the industry to speed-up re-balling time and make better quality solder balls.

P/N Stencil/Insert set
Component Information		 P/N Stencil
Component pattern		 P/N Insert
XURB-S/I-156-1-15-1.2

Component Information
BGA156;
I/O Count 156;
Pitch 1.0mm;
Body Size 15mm;
Plastic Height 1.2mm

 XURB-S-156-1-15
BGA156
A = 1.0 mm; B = 15 mm; C = 1.2 mm		 XURB-I-15-1.2

X = 15 mm; Y = 15 mm; Z = 1.2 mm
XURB-S/I-456-1-23-1.6

Component Information
BGA456;
I/O Count 456;
Pitch 1.0mm;
Body Size 23mm;
Plastic Height 1.6mm

 XURB-S-456-1-23
BGA456
A = 1.0 mm; B = 23 mm; C = 1.6 mm		 XURB-I-23-1.6

X = 23 mm; Y = 23 mm; Z = 1.6 mm
XURB-S/I-324-1.27-27-1.6

Component Information
BGA324;
I/O Count 324;
Pitch 1.27mm;
Body Size 27mm;
Plastic Height 1.6mm

 XURB-S-324-1.27-27
BGA324
A = 1.27 mm; B = 27 mm; C = 1.6 mm		 XURB-I-27-1.6

X = 27 mm; Y = 27 mm; Z = 1.6 mm
XURB-S/I-352-1.27-27-1.6

Component Information
BGA352;
I/O Count 352;
Pitch 1.27mm;
Body Size 27mm,
Plastic Height 1.6mm

 XURB-S-352-1.27-27
BGA352
A = 1.27 mm; B = 27 mm; C = 1.6 mm		 XURB-I-27-1.6

X = 27 mm; Y = 27 mm; Z = 1.6 mm
XURB-S/I-696-1-31-1.8

Component Information
BGA696;
I/O Count 696;
Pitch 1mm;
Body Size 31mm;
Plastic Height 1.8m

 XURB-S-696-1-31
BGA696
A = 1 mm; B = 31 mm; C = 1.8 mm		 XURB-I-31-1.8

X = 31 mm; Y = 31 mm; Z = 1.8 mm
XURB-S/I-388-1.27-35-1.8

Component Information
BGA388;
I/O Count 388;
Pitch 1.27mm;
Body Size 35mm;
Plastic Height 1.8m

 XURB-S-388-1.27-35
BGA388
A = 1.27 mm; B = 35 mm; C = 1.8 mm		 XURB-I-35-1.8

X = 35 mm; Y = 35 mm; Z = 1.8 mm
XURB-S/I-456-1.27-35-1.8

Component Information
BGA456;
I/O Count 456;
Pitch 1.27mm;
Body Size 35mm;
Plastic Height 1.8m

 XURB-S-456-1.27-35
BGA456
A = 1.27 mm; B = 35 mm; C = 1.8 mm		 XURB-I-35-1.8

X = 35 mm; Y = 35 mm; Z = 1.8 mm
XURB-S/I-492-1.27-35-1.8

Component Information
BGA492;
I/O Count 492;
Pitch 1.27mm;
Body Size 35mm;
Plastic Height 1.8m

 XURB-S-492-1.27-35
BGA492
A = 1.27 mm; B = 35 mm; C = 1.8 mm		 XURB-I-35-1.8

X = 35 mm; Y = 35 mm; Z = 1.8 mm
XURB-S/I-596-1.27-35-1.8

Component Information
BGA596;
I/O Count 596;
Pitch 1.27mm;
Body Size 35mm;
Plastic Height 1.8m

 XURB-S-596-1.27-35
BGA596
A = 1.27 mm; B = 35 mm; C = 1.8 mm		 XURB-I-35-1.8

X = 35 mm; Y = 35 mm; Z = 1.8 mm
XURB-S/I-676-1.27-37.5-1.8

Component Information
BGA676;
I/O Count 676;
Pitch 1.27mm;
Body Size 37.5mm;
Plastic Height 1.8m

 XURB-S-676-1.27-37.5
BGA676
A = 1.27 mm; B = 37.5 mm; C = 1.8 mm		 XURB-I-37.-1.8

X = 37.5mm; Y = 37.5mm; Z = 1.8mm
XURB-S/I-432-1.27-40-1.6

Component Information
BGA432;
I/O Count 432;
Pitch 1.27mm;
Body Size 40mm;
Plastic Height 1.6m

 XURB-S-432-1.27-40
BGA432
A = 1.27 mm; B = 40 mm; C = 1.6 mm		 XURB-I-40-1.6

X = 40 mm; Y = 40 mm; Z = 1.6 mm
XURB-S/I-69-0.8-11x8-1

Component Information
BGA69;
I/O Count 69;
Pitch 0.8mm;
Body Size 11x8mm;
Plastic Height 1mm

 XURB-S-69-0.8-11x8

A = 0.8 mm; B1 = 11 mm;
B2 = 8 mm; C = 1.6 mm		 XURB-I-11x8-1
XURB-S/I-208-0.8-15-1.2

Component Information
BGA208;
I/O Count 208;
Pitch 0.8mm;
Body Size 15mm;
Plastic Height 1.2mm

 XURB-S-208-0.8-15

A = 0.8 mm; B = 15 mm; C = 1.2 mm		 XURB-I-15-1.2

X = 15 mm; Y = 15 mm; Z = 1.2 mm

How to use the Re-balling Set

  1. Before Beginning to reball you component you must first remove the old solder balls and solder residual. It is recommended that you use XS-StencilCleaner each time you perform the reballing process. this will extend the life of your stencil and improve the reballing process.
  2. Place the XURB Insert into the Reballing frame.
  1. Place the component to be reworked in the insert with the surface to be reballed face up.

  1. Use the Micro Squeegee to apply flux evenly to the IC body.
  1. Place the appropriate re-balling stencil over the IC ensuring that it aligns with the positioning pins on the insert.

  1. Place the stencil holding frame on the top of the stencil and tighten the knob.




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American Distribution

United States of America,
Canada and Mexico: 
BOMIR INC. (Master Distributor)
E-mail: bomir@bomir.com
Tel: (570)842-4725
Fax: (570)842-4290

Disclaimer

Bokar International is committed to continuing development of new products and improvements to existing products. Specifications are subject to change without notice.

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